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According to Odaily, South Korean media report that Samsung Electronics and SK Hynix are re-evaluating the timeline for adopting hybrid bonding technology in the next generation of high-bandwidth memory (HBM). As the demand for further thickness reduction and improved thermal performance in HBM has decreased, the market now expects the introduction of this technology may be postponed even further compared to previous projections. At the same time, both companies are developing new cooling solutions such as HPB and iHBM, which they plan to apply to their HBM5 products. However, industry insiders believe that as the number of HBM I/O channels continues to increase in the future, hybrid bonding will remain an important mid- to long-term technological direction.

Golden Ten Data, July 6 — According to a comparison of domestic gold jewelry prices today, the price of pure gold jewelry from many domestic brands has increased by about 7 yuan per gram compared to last Friday, with most prices quoted in the range of 1,260–1,269 yuan per gram.

```htmlGolden Ten Data July 6｜Nomura Asset Management Chief Strategist Hideyuki Ishiguro stated in a report that global chip-related stocks are under pressure due to concerns about the supply and demand situation in the storage market and profit-taking from leveraged ETFs. In a July 6 report, Ishiguro wrote, "There are worries that the rise of Chinese storage chip manufacturers may worsen the storage market situation, and adjustments in holdings of Korea-listed leveraged semiconductor ETFs triggering profit-taking are the reasons behind the decline in chip stocks." In the short term, stock prices are driven by supply and demand as well as investor sentiment. However, he added, chip manufacturing companies still have upward momentum stemming from AI-related earnings growth and expanding free cash flow.```